BlueCore6-ROM in WLCSP allows a complete Bluetooth subsystem (excluding antenna) to be assembled in just 27.4 mm². The coloured areas show the sizes required for three competitive devices.
This device is fabricated using 130nm CMOS process geometry, resulting in a much smaller die. This has allowed CSR to offer the device packaged in a 3.5 x 3.2 mm WLCSP form. This is up to 50% smaller than some competitors! A QFN packaged device is also available.
In conjunction with a reduced requirement for external components (9 passive components, plus balun and antenna), the WLCSP-packaged Bluetooth system complete with external components requires just 4.8 x 5.7 mm of PCB space - excluding the antenna. The reduced height of the device (0.7 mm) also helps developers achieve ultra-thin portable devices.
Reliability is also assured. As part of WLCSP development, CSR has subjected devices to testing sequences that are significantly harsher than industry-standard JEDEC temperature and drop testing programs —your local CSR office will be pleased to provide details.