2015 年 8 月 13 日時点で、Qualcomm Incorporated の子会社である Qualcomm Global Trading Pte. Ltd. は、CSR 社の買収を完了したことを
謹んでご報告申し上げます。詳しくは、プレスリリースをご覧ください。

SiRFatlasVI™

SiRFatlasVI™ はARM Cortex 9 CPU コア(最大1GHz)を統合します。ローエンドおよびミドルレンジ製品が対象です。

CSR のインフォテインメント SoC、SiRFatlasVI は、全体の費用を低価格に抑えつつ、市場投入までの時間の短縮化を図りながら、車の一般的なダッシュボードで高度なグラフィックス、ロケーション、コネクティビティを提供するように設計されたものです。GNSS、Bluetooth® および Wi-Fi®はあらかじめ最適化されています。

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Overview

Platform Solutions

Base Software

  • Includes BSPs to support location, graphics, and multimedia
  • Windows CE 6.0, Android 4.0 and Linux

Location Software

  • SiRFInstantFix™ extended ephemeris services
  • SiRFDiRect™ GPS/Dead Reckoning software for continuous and accurate positioning

Application Software

  • CSR Bluetooth stack / profiles, Wi-Fi driver
  • CSR cVc echo-cancellation software

Software Services

  • Bluetooth and Wi-Fi interoperability (IOP) and coexistence testing

Other Platform Components

  • CSR3000 GNSS companion RF, CSR8000 Bluetooth and Bluetooth Low Energy (CSR μEnergy®), CSR6000 Wi-Fi, CSR1300 Single-Mode Bluetooth Low Energy, Vaddis DVD Servo, Camera solution

 

  • Enables greater user experience at similar BOM cost compared to previous-generation Atlas product: 3x CPU DMIPs, 3x graphics and 6x multimedia performance improvement, enabling the driver to experience more fluid user interfaces, richer map graphics, and concurrent navigation and up to 720p media playback
  • Integrated multi-satellite GNSS capabilities support all global navigation systems, providing flexibility and improved satellite acquisition and location tracking in challenging situations like urban canyons. Support for industry-leading dead reckoning technologies is also provided
  • Value leadership: powerful performance, competitive BOM cost, direct local R&D support
  • Supports concurrent multiple user scenarios on in-vehicle infotainment system, PND, MID, and other modern multifunction devices
  • Short time-to-market at low overall cost: High SoC integration, simplified hardware design including a PCBfriendly 0.65-mm ball pitch package, fully qualified BSPs with location and connectivity platform solutions, plus local engineering support

CPU

  • ARM Cortex™A9: 800MHz@2000DMIPS, and up to 1GHz@2500DMIPS
  • 32KB I-cache / 32KB D-cache, ARM NeonTM

Integrated GNSS Baseband

  • Support for GPS, Glonass, Galileo, and Compass (after a software upgrade) , with external CSR3000 RF chip
  • SiRFDRive® dead reckoning

Memory

  • 16-bit DDR3, DDR3L,  LPDDR2 up to 512MB

NAND and Boot Devices

  • Direct boot supported from SDXC, SLC NAND flash, managed NAND
  • SLC/MLC/TLC 512B/2K/4K/8K/16KB page, 64/128/192/256 pages per block
  • 8-bit data width with 12/24/40/60-bit ECC engine
  • eMMC 4.4 support

2D/3D Graphics

  • Up to 8M triangles/s and 250Mpixels/s fill-rate
  • OpenGL ES 1.1/2.0, OpenVG 1.1 support
  • Resolution up to 1280 x 720
  • Four hardware overlays

Multimedia

  • Hardware Video Post Processor capable of color space conversion and advanced deinterlacing (scaling 1/8-8)
  • Independent brightness/contrast control
  • 8-bit VIP supporting up to 5M pixel camera and CCIR656 input
  • Left-right mirror function to support instant backview

Integrated I/O and Analog Functionality

  • Two USB 2.0: one with on-chip PHY, one with external PHY
  • UART/I2S/SPI/I2C
  • Touch-screen controller and audio codec

Package

  • Automotive and industrial: 13.4 x 12.6 x 1.16mm 0.65mm pitch 362-ball FCBGA
  • Temperature range for industrial parts: -40~+85C

Terms of Supply

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