2015 年 8 月 13 日時点で、Qualcomm Incorporated の子会社である Qualcomm Global Trading Pte. Ltd. は、CSR 社の買収を完了したことを
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SiRFprimaII™

SiRFprimaII™ はARM® Cortex A9 CPU コア(最大 1GHz)を統合します。ミドルレンジおよびハイエンド製品が対象です。

SiRFprimaII は CSR のロケーション SoCs ファミリーの最新バージョンで、統合された GNSS 機能を備えています。この機能は、タブレットコンピューターから一般的な車のダッシュボードに至るまで、ロケーション、コネクティビティ、マルチメディアにおいて充実したエクスペリエンスを実現できるように設計されたものです。

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Overview

Supported OS

  • WinCE, Linux, Android

Supported Software

Standard

  • Base software platform to support core location, graphics, and multimedia functions

Premium

  • SiRFInstantFix™ extended ephemeris services
  • SiRFDiRect™ GPS/Dead Reckoning software for continuous and accurate positioning for portable navigation

Other Features

  • Cortex A9 2000+ DMIPS
  • V7 GPS Engine
  • Open GLES 2.0 HW Accelerator
  • 1080p Multimedia Decoder
  • DDR3 & LPDDR2 (16/32 bit)
  • PMU Integration
  • Audio Codec
  • 40nm Process
  • More than twice the application throughput and 3-4x more powerful graphics and multimedia acceleration than the previous generation, enabling the users to experience more fluid user interfaces, richer map graphics, and concurrent navigation and HD1080p media playback
  • Integrated multi-satellite GNSS capabilities support all global navigation systems, providing flexibility and improved satellite acquisition and location tracking in challenging situations like urban canyons. Support for industry-leading dead reckoning technologies is also provided
  • Price/performance breakthrough enables a new market segment
  • Enables multiple concurrent applications and a fluid user experience for in-vehicle infotainment, PND, and other modern multifunction devices
  • High SoC integration, simplified hardware design including a 0.8-mm ball pitch package, fully qualified BSPs with location and connectivity platform solutions, plus local engineering support help reduce overall costs and speed time-to-market
  • Price/performance breakthrough enables a new market segment
  • Integrated multi-satellite GNSS capabilities support all global navigation systems, with industry-leading dead reckoning technologies
  • More than twice the application throughput and 3-4x more powerful graphics and multimedia acceleration than the previous generation supports a rich graphic, video and audio experience
  • Enables multiple concurrent applications and a fluid user experience for in-vehicle infotainment, PND, and other modern multifunction devices
  • High SoC integration, simplified hardware design including a 0.8-mm ball pitch package, fully qualified BSPs with location and connectivity platform solutions, plus local engineering support in Asia help reduce overall costs and speed time-to-market

Terms of Supply