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SiRFstarIII™ GSC3e/LPa

SiRFstarIII™ GSC3e/LPa

Description

Packing SiRFstarIII technology plus a new RF front end specifically designed for the automotive market, this chip is the fully automotive qualified version of the SiRFstarIII chip that established itself as the standard in the high-volume, GPS consumer market. Equipped with 200,000 correlators - for fast time-to-first-fix and deep signal searches - this chip also supports value added Dead Reckoning and SiRFInstantFix technology.

Key features

AEC-Q100 qualified
SiRFstarIIIGPS core
Digital and RF in a single package
50-MHz ARM7TDMI processor plus 1 Mb SRAM to enable user tasks
Supports reference frequencies 16.369 and 26.0 MHz
Extensive GPS receiver peripherals: two UARTS, high speed serial bus, battery-backed SRAM, ten GPIOs
Lead free and ROHS compliant

Benefits

GSC3e/LPa incorporates variety of features suited to the automotive market. The RF front end includes a dual range bandwidth IF filter. The narrow band filter setting, 2 MHz, is useful in rejecting unwanted near-band signals, and is recommended for most automotive applications. The wide band filter setting, 6 MHz, accommodates a broader view of spectrum.
The software supports SiRFInstantFix technology, which eliminates the initial task of obtaining broadcast GPS data from the satellites themselves, resulting in a faster time-to-first-fix even in weak signal environments. SiRFInstantFix technology comes in two variants; a version that provides seven days of prediction with an over-the-air or internet connection, and client generated version that allows a three-day prediction with complete autonomy.
Additionally, the GSC3e/LPa supports SiRFDrive1 and SiRFDrive2. SiRFDrive1 uses a dedicated gyro yaw sensor along with odometer speed and direction signals from the vehicle. SiRFDrive2 does not require a dedicated gyro yaw sensor and accesses sensor information available on the vehicle bus as messages. SiRFDrive2 provides substantial system cost savings through the elimination of dedicated Dead Reckoning sensors.

GPS Architecture Highlights

200,000+ effective correlators for very fast TTFF and high sensitivity acquisition
High sensitivity for indoor fixes
SBAS (WAAS, MSAS, EGNOS, GAGAN) support
Configurable as PVT or host-based tracker
Low 100 ms interrupt load on microprocessor
Up to 20-channel architecture
Integrated dual-range IF band filter with default 2 MHz bandwidth for improved near-band jamming mitigation

Supported Software

Standard

GSW3 GPS software (API compatible with GSW2)

Premium

SiRFInstantFix extended ephemeris service
SiRFDrive GPS/Dead Reckoning software for continuous and accurate positioning for in-dash navigation

Package

Type: 121-ball grid array (BGA) with a pitch of 0.80mm Pb free
Dimensions: 10 mm x 10 mm; Height: 1.4 mm

Product details

Horizontal Position Accuracy¹

Autonomous <2.5 m
SBAS <2.0m

Velocity Accuracy²

Speed <0.01 m/s
Heading <0.01°

Time To First Fix³

Hot start - Autonomous <1 s
Warm start - Autonomous <35 s
Cold start - Autonomous <35 s
With SiRInstantFix - as low as 5 s

Sensitivity⁴

Autonomous acquisition -142 dBm
Tracking -159 dBm

Receiver

Tracking - L1, CA Code
Channels - up to 20
Max update rate - 1 Hz
Max altitude/velocity - <60,000 ft/<1,000 knots
Protocol support - SiRF Binary, NMEA

System Integration

I/O Interface - UART
External reference clock - 16.369 and 26 MHz
RTC input - 32.768 kHz

Power⁵

Continuous Autonomous operation - 62 mW
TricklePower - 40 mW

Size

Package dimensions 10 x 10 x 1.4 mm

Footnotes:

50% 24 hr static, -130 dBm
50% @ 30 m/s
50% -130 dBm Fu 0.5 ppm Tu ±2 s Pu 30 Km
-142 dBm ≈ 28 dB-Hz with 4 dB noise figure
Average, TricklePower 200:1

Subject to approval, a datasheet can be made available for this product via CSR Support.